Black Epoxy Resin Ab Glue Epoxy Potting Compound for Electronic Components Encapsulation

Get high-quality Black Epoxy Resin AB Glue Epoxy Potting Compound for Electronic Components Encapsulation from our factory. Durable and reliable encapsulation solution.
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PRODUCTS DETAILS

Basic Info.

Model NO.
WD1588AB
Mixing Ratio
5:1
Application
Pouring
Usage
Construction, Fiber & Garment, Footwear & Leather.
Flammable Retardant
UL-94V0
Certificate
RoHS, SGS, Reach
Type
Liquid Chemical
Main Raw Material
Epoxy
Classification
Double Components Adhesives
Water Absorption
Less Than or Equal to 0.5
Supply Ability
100 Ton/Tons Per Month
OEM
Avaliable
Shelf Life
9 Months
Cure Condition
Room Temperature
Transport Package
Barrel
Specification
5kg per bottle
Trademark
SWETE
Origin
China
Production Capacity
100 Ton/Tons Per Month

Product Description

Products Description
 
WD1588AB Insulated Bubble Free Epoxy Resin for Electronic Potting

Black Epoxy Resin Ab Glue Epoxy Potting Compound for Electronic Components Encapsulation

Feature


Epoxy resin WD1588AB is a black epoxy potting resin, can be cured under normal temperature and low temperature, with good flowing property, natural defoaming, it can also be cured at high temperature.


Application

WD1588AB can be widely used for electronics potting, power encapsulation, mold filling and the insulation of other electronic components, moisture proof, confidential encapsulation, etc.


Black Epoxy Resin Ab Glue Epoxy Potting Compound for Electronic Components Encapsulation

Product properties
 
Part WD1588A WD1588B
Color Black Red black
Specific gravity 1.65 0.96
Viscosity(25ºC) 1500-4000CPS 500-2000CPS
Mixing ratio A:B=100:20(weight ratio)
Hardening conditions 25ºCx 8H to 10H or 55ºCx 2H(2g)
Usable time 25ºCx40min(100g)

 


Mixing Ratio

5:1


How to do

Black Epoxy Resin Ab Glue Epoxy Potting Compound for Electronic Components Encapsulation
Black Epoxy Resin Ab Glue Epoxy Potting Compound for Electronic Components Encapsulation
Black Epoxy Resin Ab Glue Epoxy Potting Compound for Electronic Components Encapsulation Black Epoxy Resin Ab Glue Epoxy Potting Compound for Electronic Components Encapsulation
MEASURING

With gloves on, pour equal amounts of resin and hardener into a mixing cup. And then pouring the mixture into another clean mixing cuo to make sure you are mixing it well.

TIP - Mix up a little more than you think you'll need because you want to completely cover your work in one shot and not have to mix more later.



MIXING

Stir really well for at least 3 minutes. Scrape the sides and the bottom to make sure you're being thorough (unmixed material will leave you with sticky spots that just won't cure). Once you put the resin and hardener together, you'll have about 40 minutes of working time before the resin thickens and cures.



POURING

After making sure your piece is level, go ahead and pour AmazingResin over your work. Don't be scared! It'll start to level on its own, and you can spread it around into place. Let the resin run over the edges and then just use a brush to tidy it up. You'll notice bubbles will begin to rise to the surface. Many of these will pop on their own, but you can also pop them by torch.

TIP - Wooden panels work best for large pieces rather than canvas because they won't sag under the weight of the resin.

WAIT AmazingResin needs to sit for several hours in a dust-free space while it cures. In about 8 hours it will be tacky but you will be able to pour a second coat if necessary. In about 12 hours it will be dry to the touch, and within 24 hours it will be 95% cured. It will be fully cured within 72 hours. CLEAN UP - To reuse your mixing tools, wipe them down with a paper towel before the resin dries.


Package

1kg ,5kg,20kg 25kg per bottle, 20kg per set, 200kg per bucket


Storage Conditions

The product should be sealed in its original packaging container and stored in a dry and ventilated place. In an environment of 18-40ºC, the shelf life is 6 months. If the shelf life is exceeded, analysis is required to determine whether it is still valid.


Due to the storage conditions, this product may experience a small amount of precipitation during storage, which is a normal phenomenon. After stirring evenly, it can be used normally.



Black Epoxy Resin Ab Glue Epoxy Potting Compound for Electronic Components Encapsulation

Black Epoxy Resin Ab Glue Epoxy Potting Compound for Electronic Components Encapsulation

Black Epoxy Resin Ab Glue Epoxy Potting Compound for Electronic Components Encapsulation
Due to the storage conditions, this product may experience a small amount of precipitation during storage, which is a normal phenomenon. After stirring evenly, it can be used normally.

Black Epoxy Resin Ab Glue Epoxy Potting Compound for Electronic Components Encapsulation

Black Epoxy Resin Ab Glue Epoxy Potting Compound for Electronic Components Encapsulation
Black Epoxy Resin Ab Glue Epoxy Potting Compound for Electronic Components Encapsulation

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